Our “EEMS” service portfolio offers you a range of process technologies that are always state-of-the-art. New processes are continually emerging in processing and device assembly to fully exploit the optimal potential for innovative products.
- SMD placement with integrated inline test and inline programming
- THT placement with wave soldering in a nitrogen atmosphere (optional)
- Testing techniques (AOI, flying probe, In-circuit test, functional test, climatic tests)
- Special test and programming procedures (incl. boundary-scan)
- Coating and casting of components
- Bonding techniques – batch and inline-oriented
- Device assembly in production islands in line with modern lean production methods